03. Electronics Packaging and Thermal Management

In recent years, the thermal management of electronic devices has become important due to the increasing performance and miniaturization of electronic devices. Therefore, accurate thermal contact resistance measurements are necessary for precise thermal design. In this research, CFD (Computational Fluid Dynamics) analysis was performed to evaluate the effect of heat loss in the steady-state thermal contact resistance measurement in two conditions. One condition is insulation material set around the test section, and another condition is without insulation. Additionally, to ensure the accuracy of the analysis, we conducted the measurement. As a result, it was confirmed that the analysis accurately represents the experimental results. The results of the analysis showed that the maximum heat loss from the test section was approximately 6% in the case without insulation. In addition, the measurement error due to the heat loss was less than 2%, indicating that the measurement was accurate even without insulation.