13. Air-Condition and Refrigeration

Based on the increasing requirements for electronic cooling, especially chips, recently vapor chambers with cooling using liquid cold water that is directly flowed into the vapor chamber can effectively overcome the excess heat on chips. However, adjusting the temperature and flow rate of the cooling water provides a heat absorption effect that will help the Vapor Chamber to maintain the chip temperature at the expected operational limit. In addition, thermal resistance also plays an important role in indicating the quality of the vapor chamber in terms of proper heat transfer. Therefore, this study compares the effect of cold-water supply temperature settings between 20°C and 26°C with flow rate settings between 2.0LPM and 2.60LPM on the heat transfer performance of the vapor chamber in maintaining the heat source temperature that is powered by 500W. As a results through experiment, the resulting heater temperature that can be maintained in conditions of 20°C; 2.00LPM is around 107.05°C, while in conditions of 20°C; 2.60LPM is around 104.18°C, and for conditions of 26°C; 2.60LPM is 110.00°C. Minimum thermal resistance for two-phase cooling that occurs in the vapor chamber is 0.059°C/W for conditions of 20°C; 2.60LPM and 26°C; 2.60LPM. While the thermal resistance in the condition of 20°C; 2.00LPM increase up to 0.064°C/W. However, the pump consumption of the 2.00LPM flow rate is only 0.40W while for the 2.60LPM flow rate condition is 0.80W. So, for conditions of 20°C; 2.60LPM has the lowest heater temperature that can be maintained with minimum thermal resistance but has twice the pump consumption compared to a flow rate of 2.00LPM with the same water supply temperature.