04. Boiling and Multi-Phase Flow

Nowadays, the increasing power density and compactness of modern electronic devices have resulted in significant heat generation, highlighting the importance of efficient cooling methods, especially in high heat flux applications. This research presents a new remote loop thermosyphon (RLTS) design customized for automotive applications, meeting the pressing need for effective thermal management solutions. The proposed RLTS comprises a condenser with multiple port flat tubes and louver fins, an evaporator with skived fins for enhanced surface, and utilized R-1233zd as the working fluid. The RLTS effectively managed heat loads up to 800 W and efficiently dissipated heat fluxes up to 128 W/cm². These findings emphasize the potential of this design for high-performance electronic cooling applications in automotive systems, where space constraints and high heat loads are common challenges. An experimental investigation was conducted to identify the key factors influencing thermal performance, including heat load, filling ratio, and inlet air velocity, which were examined as critical factors affecting thermal performance, providing valuable insights for further exploration and optimization. In assessing the effects of the filling ratio, a range of filling ratios between 35% and 60% were tested, along with inlet air velocities ranging from 2 to 4 m/s. The experimental results demonstrated that when the thermal module was subjected to a heat load of 800 W and an inlet air velocity of 4 m/s, the RLTS exhibited a minimum thermal resistance of 0.088 K/W. In addition, the examination of filling ratio effects revealed the presence of an optimal filling ratio at which the RLTS operates most efficiently. Among the tested filling ratios, 45% exhibited superior performance. Furthermore, when the inlet air velocity increased, the thermal resistance decreased at the optimum filling ratio and showed an increase in heat dissipation capacity.