03. Electronics Packaging and Thermal Management

In recent years, the heat generation density of electronic devices has steadily increased because of miniaturization and higher performance. The temperature inside the electronic device rises due to the higher heat generation density of electronic devices. This leads to performance reduction and failure of the electronic devices. Therefore, thermal management is important for reliability of the electronic devices. It is necessary to consider precise thermal contact resistance when performing thermal management. Prediction formulas for thermal contact resistance have already been proposed. The Tachibana-Sanokawa equation is widely known to predict thermal contact resistance. The electronic devices are being used under 10 to 1000 kPa. But, the Tachibana-Sanokawa equation’s predictive accuracy is not clearly defined under 10 to 1000 kPa. For the accuracy improvement, accurate experimental results of thermal contact resistance value are needed. Steady-state thermal contact resistance measurement methods are used to evaluate the thermal contact resistance. Though the test section of the steady state method should be thermally insulated, sometimes the insulation is difficult because of complex wiring. Therefore, measurement accuracy without insulator should be evaluated. In this study, thermal contact resistance measurements are performed with and without insulator to evaluate thermal contact resistance. After that, CFD (Computational Fluid Dynamics) analysis are performed with and without insulation materials to evaluate the effect of heat loss on the steady-state method thermal contact resistance measurements.