03. Electronics Packaging and Thermal Management

Nowadays, miniaturization and high thermal power are characteristic features of chips, making effective thermal management crucial. Liquid cooling technology is among the most effective chip cooling methods. This paper proposes a manifold microchannel liquid cooling plate (MMLCP) for chip cooling and the effects of the numbers of manifolds and the volume flow rates on the temperature distribution, thermal resistance, and pressure drop of the MMLCP are investigated through experimental and simulation methods. The results indicate that increasing the volume flow rate and the number of manifolds within a certain range enhances the thermal performance of the MMLCP, while reducing thermal resistance and pressure drop. The MMLCP performed optimally when the number of manifolds is 2. A heat source with a heat load of 500 W can be cooled to 61.68 °C at a volume flow rate of 1.0 L/min, achieving a thermal resistance of only 0.063 °C/W and a pressure drop of only 5.81 kPa. The MMLCP offers a novel solution for future chip cooling.