03. Electronics Packaging and Thermal Management

With the miniaturization and high-density mounting of electronic devices, the heat generation density of electronic components incorporated in devices is also increasing. The same tendency applies to passive components such as resistors. In the design of such electronic components, the temperature rise of the components is estimated by steady-state and transient heat transfer analysis, and measures are taken to reduce the temperature rise. In this series of studies, a heat transfer analysis model that can accurately predict the temperature is required, and it is also important to understand the thermophysical properties of the materials that affect the accuracy of the analysis. This study proposes a new thermophysical property analysis method that combines an electrical-pump thermoreflectance method and a structure function for relatively thicker film materials such as resistors. Specifically, the thermoreflectance method with rectangular pulse heating enables temperature measurement in the time range of several µs to several tens of ms, which could not be evaluated with existing methods. Furthermore, we attempted to simultaneously analyze the thermal conductivity and specific heat of the film material by generating a structure function from the acquired transient temperature rise profile. In this report, we report the results of the temperature measurement and thermophysical property analysis, as well as the results of the validation of the thermophysical property values. In the validation of the thermophysical properties, the steady-state method, the DSC method, and the gravimetric measurement were selected as the comparison methods.

Mr.

Hirotoshi Aoki