09. Heat and Mass Transfer

The concept of using microchannels in heat sinks are conceptually well established and have attracted considerable attention over the past four decades. A fluidic oscillator is a device with no moving parts, which is one of its most attractive features. Most research on fluidic oscillators has focused on their hydrodynamic properties, and the employment of sweeping jets induced by fluidic oscillators to enhance heat transfer is relatively new. The present investigation fluidic oscillator is employed for the cooling of microchannel heat sinks. Numerical analysis on the flow and thermal performance of the microchannel heat sinks has been conducted. Commercial software, ANSYS-Fluent, is employed for the present study. The flow is considered as transient, laminar, and incompressible flow. There are approximately 500,000 elements in the analysis. Water is used as the working fluid. The supplied pressure difference is 3000 Pa and the power is 50W with the heating surface of 25.4 mm × 25.4 mm. The time step is set as 5 ms, the inlet temperature of water is set as 300 K. Adiabatic condition is considered for the surrounding of the heat sink. The effective thermal resistance and the temperature uniformity of the heating surface for heat sink with fluidic oscillator are compared to those without fluidic oscillator. It is found that the time needed is approximately 3s for steady condition. The average temperature and temperature uniformity of heating surface have been improved with the fluidic oscillator.

Mr.

Che-Hsu Lin

Presenting author